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5 edition of Thin Films, Stresses and Mechanical Properties V (Materials Research Society Symposium Proceedings) found in the catalog.

Thin Films, Stresses and Mechanical Properties V (Materials Research Society Symposium Proceedings)

  • 306 Want to read
  • 34 Currently reading

Published by Materials Research Society .
Written in English

    Subjects:
  • Material Science,
  • Reference,
  • Technology,
  • Technology & Industrial Arts,
  • Science/Mathematics

  • Edition Notes

    ContributionsS. P. Baker (Editor), C. A. Ross (Editor), P. H. Townsend (Editor), Cynthia A. Volkert (Editor), P. Borgesen (Editor)
    The Physical Object
    FormatHardcover
    Number of Pages901
    ID Numbers
    Open LibraryOL12091893M
    ISBN 10155899257X
    ISBN 109781558992573

    The elastic and failure mechanical properties, the d 31 piezoelectric coefficient and the effect of applied stress on the hysteresis curves of freestanding PZT composite films, comprised of SiO 2, Pt, PZT and Pt, were measured from microscale tension d 31 coefficient was measured from the out-of-plane deflection of biased PZT specimens with dimensions similar to those of MEMS Author: S. Yagnamurthy, Ioannis Chasiotis. Thin films composed of carbon nanotubes (CNTs) are an emerging class of material with exceptional electrical, mechanical, and optical properties that can be readily integrated into many novel devices.[1–4] These features suggest that CNT films have potential applications as conducting or semiconducting layers in different types of electronic, optoelectronic, and sensor by:

      In this study, the contact problems of thin films and cover plates are considered. In these problems, the loading consists of any one or combination of stresses caused by uniform temperature changes and temperature excursions, far field mechanical loading, and residual stresses resulting from film processing or by:   Structural and mechanical properties of metal/polymer systems are of great interest for technological applications since they strongly influence the quality and lifetime of these systems. The phase composition, microstructure, and residual stresses of tungsten films sputter deposited on polyimide substrates have been analyzed by x-ray by:

    Spider silk has exceptional mechanical and biocompatibility properties. The goal of this study was optimization of the mechanical properties of synthetic spider silk thin films made from synthetic forms of MaSp1 and MaSp2, which compose the dragline silk of Nephila clavipes. We increased the mechanical stress of MaSp1 and 2 films solubilized in both HFIP and water by adding glutaraldehyde and Cited by: Abstract. Instrumentation for the testing of mechanical properties on the submicron scale has developed enormously in recent years. This has enabled the mechanical behavior of surfaces, thin films, and coatings to be studied with unprecedented accuracy.


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Thin Films, Stresses and Mechanical Properties V (Materials Research Society Symposium Proceedings) Download PDF EPUB FB2

One of the simplest ways to measure the mechanical properties of a thin film is to deform it on a very small scale. Because indentation testing with a sharp indenter is one convenient means to accomplish this, nanoindentation, or indentation testing at the nanometer scale, has become one of the most widely used techniques for measuring the mechanical properties of thin by: A measurement of thin-film properties is indispensable for the study of thin-film materials and devices.

The chemical composition, crystalline structure, and optical, electrical, and mechanical properties must be considered in evaluating thin films. Several methods are proposed for the evaluation of the thin films, summarized in Table Introduction.

In this chapter we turn our attention to mechanical properties and the stresses that develop in thin films on substrates. One usually thinks of mechanical properties, such as elastic modulus and yield strength, as properties of importance for only structural materials, where load bearing is the primary by: 5.

Diamond-Like Carbon films with thicknesses controlled in the 10 to nm range were sputter-deposited on single crystals of MgO. The substrates were prepared with varying roughness from Thin Films to 50 nm and varying surface dislocation densities from to disl./μm ical properties of the film and film-substrate interactions were investigated with an atomic force microscope retrofitted Cited by: 3.

Waters, Patrick, "Stress Analysis and Mechanical Characterization of Thin Films for Microelectronics and MEMS Applications" ().Graduate Theses and Dissertations.

Get this from a library. Thin films: stresses and mechanical properties V: symposium held November December 2,Boston, Massachusetts, U.S.A. [Shefford P Baker; Materials Research Society.;].

Thin Films Volume Stresses and Mechanical Properties V (Materials Research Society Symposium Proceedings) dontaeroy Thin Films Stresses and Mechanical Properties IX Volume (MRS Proceedings) Ebook Ferroelectric Thin Films: Basic Properties and Device Physics for Memory Applications.

Aikashi. Get this from a library. Thin films, stresses, and mechanical properties IV: symposium held April, San Francisco, California, U.S.A.

[Paul H Townsend; Materials Research Society. Spring Meeting;]. Due to mechanical and thermal loads which induce mechanical stresses in the encapsulated solar cells, photovoltaic modules may experience electrical power loss during service [2,3].Author: Dimitrios Antartis.

Mechanical properties of thin films have been reviewed by Hoffman and also by Campbell. However, the structure of thin films often has a crucial effect in determining other thin-film properties and, unlike the thermal and mechanical properties, is very largely determined by.

T1 - Characterization of mechanical properties and residual stresses for Ni- Co thin films. AU - Ahn, Joong Hyok. AU - Bae, Hong Yeol. AU - Kim, Yun-Jae. AU - Park, Jun Hyub. PY - /12/1. Y1 - /12/1. N2 - The present work characterizes mechanical (elastic and plastic) properties and residual stresses of a Ni-Co thin film having m Author: Joong Hyok Ahn, Hong Yeol Bae, Yun-Jae Kim, Jun Hyub Park.

The physical properties of thin metal films [Book Review] mechanical internal stresses and the kinet- properties of v arious thin film materials. Origin of residual stresses in thin films 1.

Epitaxial stresses Epitaxial stresses arise when films have perfectly coherent interfaces with their substrates, i.e., when the crystal lattices in film and substrates line up perfectly. a s a f σ mfσ e.g.

Cubic on cubic: Fe on GaAS, AlAs on GaAS Cubic on hcp: {} plane in cubic film on ( Tungsten thin films were deposited on glass substrates by direct‐current planar magnetron sputtering.

The induced thickness‐averaged film stress within the plane of the film was determined with the bending‐beam technique and changed from compressive to tensile on increasing working‐gas pressure. The microstructure of these films was investigated by cross‐sectional transmission Cited by: @article{osti_, title = {Influence of Cu deposition conditions on the microstructure and adhesion of Cu/Cr thin film to polyimide film}, author = {Joh, C H and Kim, Y H}, abstractNote = {The microstructure of Cu thin films in various deposition conditions and the influence of their microstructure on the adhesion strength between Cu/Cr films and polyimides were studied.

Abstract. Thin film — substrate interaction, residual stress and elastic properties in the disperse and films of nanometeric size are of great importance in the development of microsystems, nanostructures and nanomaterials when working with atoms, molecules or supramolecule by: 1.

@article{osti_, title = {Effect of film thickness on structural and mechanical properties of AlCrN nanocompoite thin films deposited by reactive DC magnetron sputtering}, author = {Prakash, Ravi and Kaur, Davinder}, abstractNote = {In this study, the influence of film thickness on the structural, surface morphology and mechanical properties of Aluminum chromium nitride (AlCrN) thin.

Relating mechanical testing and microstructural features of polysilicon thin films - Volume 14 Issue 3 - S. Jayaraman, R. Edwards, K.

HemkerCited by: Hardness measurements obtained from scratch experiments are presented for thin-film rigid disks with 30 nm carbon overcoats. Reproducible results are obtained for residual scratch depths greater than approximately 8 nm. A simple force balance model is used to calculate the effective hardness of the layered by: On a series of Ag‐Al, Ag‐Au, Ag‐Cu, Au‐Cu, and Au‐Fe thin films, made by vapor deposition, both ultramicrohardness and internal stress were determined as a function of the chemical composition of the deposits.

In order to interpret these results microstructural investigations were performed using x‐ray diffraction and transmission electron microscopy, supplemented by electrical Cited by:.

(j = ) define normal mechanical stresses or strains and (j = ) represent shear strains or stresses. In the direct effect using equa tion (1), a mechanical stress Vj or strain S j causes a net electrical displacement, D i, on i faces of the material, the magnitude of .The methods that have been developed for extracting thin-film mechanical properties from the often convoluted mix of film and substrate properties measured by nanoindentation are discussed.

Interpreting the data is frequently difficult, as residual stresses can modify the contact geometry and, hence, invalidate the standard analysis routines.Silicon nitride and silicon oxynitride thin films are widely used in microelectronic fabrication and microelectromechanical systems (MEMS).

Their mechanical properties are important for MEMS structures; however, these properties are rarely reported, particularly the fracture toughness of these films.

In this study, silicon nitride and silicon oxynitride thin films were deposited by plasma Cited by: 2.